Particle characterisation of abrasives

Slurries are aqueous dispersions of compact or mesoporous particles that are essential for hi-tech technologies. Silica-based slurries are used in various industrial processes, such as the production of CDs, hard disks and the polishing of optical surfaces, among others. The properties of abrasives, such as their structure and size distribution, are crucial for their effectiveness of their operation. CLASSIZER™ ONE is an ideal tool for characterising size distribution, the density of the mesoporous structure (how compactly and evenly the pores are distributed within the abrasive) and the presence of unwanted particles (dirt, dust, etc.) or submicron aggregates.

Example: silica particles

Commercial silica particles are widely available on the market. The figures show EOS CLOUDS of a mix of 0.3 µm and 2.0 µm monodisperse silica spheres. Two separate ‘clouds’ appear and can be analysed independently. The measured numerical concentrations are 1.4×10^6 particles/ml for the 0.3 µm sample and 1.3×10^5 particles/ml for the 2 µm sample.

Example: CeO2 slurry

Cerium oxide (CeO2), also known as ceria, is widely used as an abrasive for chemical-mechanical polishing (CMP) of silicon surfaces. A few microlitres of a CeO2 slurry are dispersed in water. The SPES data are shown in the figure. The EOS software determines a refractive index of 2.0 ± 0.4, which agrees with the expected value.

Example: diamond paste

Diamond, both natural and synthetic, is used in high-performance cutters, chainsaws, drills, and polishing and lapping machines. Their main advantage over other abrasives is their superior (cutting) performance and durability. The EOS software determines a refractive index of 2.4 ± 0.4, which corresponds to the expected value.

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Particle characterisation of abrasives l Inventech

CLASSIZER™ ONE is an ideal tool for characterising abrasives.