Inventech Menu

In-line 3D dynamic image analysis


Dynamic image analysis (DIA) is the most recent and advanced particle characterization technique. This technique has a high resolution with which different size and shape parameters are measured. The thickness (T), can only be measured with Microtrac MRB patented 3D technology.

With the unique 3D image analysis technology from Microtrac MRB you are able to measure all shape, size and thickness parameters of your product in real time and with high resolution. The three-dimensional image that is created of the particles, in real-time and continuously, gives you important information about your production process. In just a few seconds, the Microtrac PartAn displays up to 32 different particle parameters within a range of 0.035 to 35 millimeters. This technique is uncomplicated, easy to use, in-line available and suitable for many industries. It can also be linked to any industrial control system.

Key benefits

Measure at high speed and high resolution
Highly accurate
0.035 - 35 millimeters or 0.28 - 127 millimeters measuring range
3D analysis: all shape and size parameters are measurable
Contact us today

What would you like to measure?

Contact us for more information, we are happy to help.

Vul onderstaande gegevens in om meer informatie te ontvangen. U ontvangt een e-mail met de gevraagde informatie.