Real-Time 3D Image Analysis

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Dynamic Image Analysis (DIA) is the most recent and widely applied particle characterization technique. This technique has a high resolution that allows different size and shape parameters to be measured. But the smallest particle dimension, the thickness (T), can only be measured with the patented 3D technique of M&W Microtrac.

With M&W Microtrac's unique 3D image analysis technique, you can meet all shape, size and thickness parameters of your product in real time in high resolution. The three-dimensional image that is created of the particles in real-time and continuously gives you important information about your manufacturing process. In just a few seconds, the CAMSIZER ONLINE from M&W Microtrac displays up to 32 different particle parameters, within a range of 0.030 to 30 millimeters. This uncomplicated technique is easy to use and can be used online in many applications and can be adapted to any industrial control system.

• Measure at high speed and high resolution Highly accurate 0.030 - 30 millimeters or 0,16 - 135 millimeters measuring range 3D analysis: all shape and size parameters are measurable