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Dynamic Image Analysis (DIA) is the most recent and widely applied particle characterization technique. This technique has a high resolution that allows different size and shape parameters to be measured. But the smallest particle dimension, the thickness (T), can only be measured with the patented 3D technique of M&W Microtrac.

With M&W Microtrac's unique 3D image analysis technique, you can meet all shape, size and thickness parameters of your product in real time in high resolution. The three-dimensional image that is created of the particles in real-time and continuously gives you important information about your manufacturing process. In just a few seconds, the CAMSIZER ONLINE from M&W Microtrac displays up to 32 different particle parameters, within a range of 0.030 to 30 millimeters. This uncomplicated technique is easy to use and can be used online in many applications and can be adapted to any industrial control system.

Measure at high speed and high resolution Highly accurate 0.030 - 30 millimeters or 0,16 - 135 millimeters measuring range 3D analysis: all shape and size parameters are measurable